Article 2420

Title of the article

SIMULATION OF A HIGH-TEMPERATURE THIN-FILM SENSOR OF THE GAUGE PRESSURE MEASURING SYSTEM 

Authors

Cheburakhin Igor Nikolaevich, chief technologist, Research and development institute for physical measurements (8/10 Volodarskogo street, Penza, Russia), E-mail: info@niifi.ru
Trofimov Alexei Anatol’evich, doctor of technical science, professor, sub-department of information and measuring equipment and metrology, Penza State University (40 Krasnay street, Penza, Russia), E-mail: iit@pnzgu.ru
Yaroslavtseva Daria Alexandrovna, design engineer, Research and development institute for physical measurements (8/10 Volodarskogo street, Penza, Russia), E-mail: levik_92@mail.ru
Zbodnov Sergey Aleksandrovich, technical director, Research and development institute for physical measurements (8/10 Volodarskogo street, Penza, Russia), E-mail: sa_zdobnov@mail.ru
Tyurin Mikhail Vladimirovich, candidate of technical sciences, senior researcher, Research and development institute for physical measurements (8/10 Volodarskogo street, Penza, Russia), E-mail:preobrazovatel@niifi.ru 

Index UDK

681.586.2 

DOI

10.21685/2307-5538-2020-4-2 

Abstract

Background. Simulation modeling is considered as the initial stage in the development of sensor-converting equipment (SCE) and systems based on it, operating in "harsh" operating conditions in units and systems of rocket and space technology. Simulation modeling methods allow analyzing the behavior of the SCE in "harsh" operating conditions. The purpose of simulation is to determine the influence of external influencing factors on the performance of a high-temperature thin-film gauge pressure measuring system (GPMS) sensor to confirm the selected technical solutions.
Materials and methods. Among modern numerical methods for calculating temperature fields, distribution of radial and tangential deformations, vibration accelerations, etc., the most suitable is the finite element method used in the specialized SolidWorks software with the Simulation module, which makes it possible to reduce the cost of performing expensive and long cycles "design – manufacture – testing". The investigated high-temperature thin-film sensor is replaced by a model used for calculations in order to obtain information about an object operating in "harsh" operating conditions.
Results. Based on the results of simulation, the calculation of the temperature fields was carried out, the distribution of the radial and tangential deformations of the thin-film sensor was determined. The arising stresses and deformations in the groove area under the influence of vibration accelerations are revealed, and the resonance frequencies are determined. Shown is a 3D model of a multichannel digital converter GPMS. 

Key words

simulation modeling, thin film sensor, pressure, the external influencing factors, a temperature profile, vibration 

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Дата создания: 12.01.2021 11:39
Дата обновления: 13.01.2021 09:17